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APPLICATION

Our Storage Chips provide high-performance, reliable solutions for efficient data storage and fast access in various electronic applications. Featuring advanced flash memory technology, these chips deliver exceptional performance with low latency and high durability, making them ideal for use in smartphones, tablets, wearables, automotive systems, and industrial applications. With high capacity, fast read/write speeds, and low power consumption, our Storage Chips optimize data storage and improve system performance across a wide range of devices. Enhance your products with our advanced, high-quality storage solutions.

  • storage chip

    With the continuous progress of science and technology, memory chips are an indispensable part of modern electronic devices. Memory chips can not only improve the storage capacity of devices, but also make electronic devices more intelligent.



  • Micro-SD Card

    Micro SD Card, also known as TF card, is the smallest mobile SD card at present; International standard size, the size is 11x15x1mm, only the size of the nail; Up to 4 layers of chip stack, maximum capacity up to 256GB; Maximum reading speed up to 100M/S; Widely used in mobile phones, digital cameras, car navigation system


  • UDP

    UDP, also known as U disk, the full name of USB flash drive, is a micro high capacity mobile storage product that uses USB interface without physical drive; Small space, fast operation speed, the highest support USB3.1 standard; Up to 8 layers of chip stack, maximum capacity up to 512GB; Safe and reliable, through the use of encryption master chip, secure memory chip; Widely used in personal and enterprise mobile storage; Banks and other storage with encryption requirements


  • BGA

    The memory encapsulated by BGA technology can increase the memory capacity by two to three times without changing the volume of the memory. Compared with TSOP, BGA has a smaller volume, better heat dissipation performance and electrical performance. BGA packaging technology has greatly improved the storage capacity per square inch, using BGA packaging technology memory products under the same capacity, the volume is only one-third of TSOP packaging; In addition, compared with the traditional TSOP package, the BGA package has a more rapid and effective heat dissipation way.