BGA is an integrated circuit (IC) packaging technology, a surface adhesive packaging technology applied in the integrated circuit, at the bottom of the BGA package, the pins are formed into a ball and arranged into a similar lattice pattern, used to connect the solder pad on the circuit board. Hence the full name: Ball Grid Array package, English: Ball Grid Array, referred to as BGA.

This Package can accommodate more pins than other packages such as Dual in-line packages or Quad Flat packages, and the entire bottom surface of the device can be used as pins instead of only around it. It also has a shorter average wire length than the surrounding defined package type for better high-speed performance. Compared with traditional packaging methods, BGA packaging has higher density and lower inductance, so it is widely used in modern electronic products.

At present, the main board control chipset mostly uses this kind of packaging technology. The BGA packages commonly used in notebooks are south bridge, North bridge, graphics cards, and in recent years, network cards, PC card control, IC and so on are also used in such packages.

Soldering BGA-packaged devices requires precise control and is usually done by automated plant equipment. HT Semiconductor has a fully automated workshop, imported equipment, and provides packaging and testing services for almost all package types. For the small size and dense layout of BGA welding balls, HT Semiconductor strictly controls the installation and welding requirements of the manufacturing equipment and process control, and achieves a yield of 99 after testing using X-ray and other testing techniques.

Here are the basics about BGA packaging:

Structure and working principle:

Ball array: The BGA chip has a regularly arranged ball array on the bottom for connection to the pad on the printed circuit board (PCB).

Heat transfer: The ball is often able to provide better heat transfer performance than traditional surface mount technology, which is very important for high power ics and chips.

Advantages:

Electrical performance: Due to the dense placement of the solder balls, BGA packages typically have lower inductance and resistance, providing better electrical performance.

Heat dissipation performance: The welding ball structure helps to improve the heat dissipation effect, especially for high power and high frequency applications.

Space utilization: BGA packages can achieve higher pin density and take up less PCB space, helping to design more compact electronics.

Stable and reliable: The number of balls in BGA is large, and the welding points of each ball can evenly withstand various hazardous factors such as electrical signals and physical friction.

Applications:

BGA package is widely used in microprocessor, memory chip, FPGA (field programmable gate array) and other high performance integrated circuits.

It is particularly common in applications that require high reliability and high-density layouts, such as consumer electronics, communications equipment, and computer servers.